[PDF.92jc] Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)

Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)

[PDF.ys01] Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)

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 |  2014-08-22 | Original language:English | PDF # 1 |  9.21 x.31 x6.14l,.0 | File type: PDF | 179 pages

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||From the Back Cover||This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitanc

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon ...

You can specify the type of files you want, for your device.Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)   |  Khaled Salah, Yehea Ismail, Alaa El-Rouby. A good, fresh read, highly recommended.

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